Acid Copper
SUNGJINLOGIS forms a stable acid copper leveling base layer to support downstream nickel/chrome appearance and thickness uniformity.
Forms a smooth, leveling foundation that directly affects downstream nickel/chrome appearance and supports spec-compliant quality.
Standardizes current, agitation, and bath conditions to minimize area variation and thickness deviation at corners and holes.
Reduces defect and rework risk through filtration/contamination control and data-driven replenishment management.
Control Points
Key control items to secure acid copper base-layer quality (leveling/thickness/appearance).
Verification Evidence
We ensure process reliability through measurable data and testing.
Typical Applications
Applied to product groups with high appearance/spec requirements.
Equipment Photos
Photos of the acid copper process equipment.